Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced that it has acquired the rights to a collection of patents from IBM -- these include fundamental patents around the area of rapid thermal annealing. Representing both U.S. and foreign patents, the portfolio includes hardware for thermal processing (annealing) of semiconductor wafers, as well as patents for temperature control and metrology. This acquisition strengthens and broadens Ultratech's annealing technology capability for ultra-shallow junction (USJ) formation -- a critical step in semiconductor manufacturing.
"Ultratech has periodically purchased patents that it views are key to our business," noted Ultratech Chairman and CEO Arthur W. Zafiropoulo. "The acquisition of these patents from IBM is the continuation of that strategy to ensure that our customers receive the highest technology content in their products. This acquisition reinforces our commitment to remain at the forefront of providing equipment with leading-edge technology and low cost-of-ownership advantages for our global customer base."
Ultratech, Inc. (NASDAQ: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography, in addition to being a pioneer of laser processing. Its advanced-packaging lithography systems deliver strong cost-of-ownership, repeatability and throughput advantages, and are widely used worldwide in the fabrication of semiconductors and FPDs. Ultratech’s advanced laser processing technology is designed to enhance yields, while enabling a cost-effective transfer to 65-nm and below production, and is being integrated into the manufacturing lines of leading- edge semiconductor manufacturers.