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Alchimer S.A.
http://www.alchimer.com/
Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films used in both semiconductor interconnects and 3D TSVs (through-silicon vias). The company’s breakthrough technology, Electrografting (eG), is an electrochemical-based process that enables the growth of very thin coatings, of various types, on both conducting and semiconducting surfaces. Based in Massy, France, Alchimer is a spin-off from the Commissariat à l’Energie Atomique (CEA). Founded in 2001, it won the First National Award for the Creation of High Tech Companies from the French Minister of Research and Industry and is a Red Herring Top 100 European Company.

ASSOCIATED NEWS:
2/28/2011 8:20:10 AM | MEMS | 0 comments
Microelectronics Innovation Collaborative Centre Licenses Alchimer’s Wet Deposition Products for MEMS 3D Research
Canadian Research-and-Development Consortium Will Use Wet Deposition Technology to Advance MEMS Production
11/30/2010 11:15:25 AM | Industry | 0 comments
RTI International Validates Alchimer’s Electrografting Technology for 3D TSV Applications
Electrografting Film Strengths Include “Excellent” Interface Trap Densities
7/13/2010 9:50:24 AM | Investment | 0 comments
Alchimer Receives Equity Investment From Panasonic Corporation
Panasonic recognizes the potential of Alchimer's groundbreaking technology for depositing nanometric films used in IC interconnects and 3D through-silicon vias.
3/9/2010 6:53:09 PM | Industry | 0 comments
Alchimer Opens 300mm Applications-and-Development Facility in Asia
Alchimer S.A., a provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias, said today it has opened a new applications-and-development facility in Seoul, South Korea, for demonstration of its innovative processes on 300mm wafers.
12/2/2009 11:51:15 PM | Products | 0 comments
New Alchimer Seedless Wet Deposition Technology Eliminates Entire Step From TSV Film Stack Process
AquiVia XS Expands Company’s Cost-of-Ownership Advantages Over Dry Deposition Technologies

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